Wafer Fab Process Engineer

VMware · Cloud, Infra & DevTools · Singapore-Depot Road

Singapore-Depot RoadIngénierie22 juillet 2026Lu sur Workday
Sur site

Fraîcheur de l'offre

Plus d'un moisVérifiée chez l'éditeur il y a 36 min

En ligne depuis plus d'un mois. Le poste est sans doute encore ouvert, mais le recruteur a déjà reçu des candidatures.

  • En ligne depuis 55 j
  • VMware retire ses offres au bout de 14 j en médiane (27 offres closes observées)

Relevé toutes les six heures sur le site de l'éditeur. L'âge compte depuis la date de publication d'origine, même après une republication.

Description

Please Note:

1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)

2. If you already have a Candidate Account, please Sign-In before you apply.

Job Description:

Job Summary
Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.

Key Responsibilities

  • Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).

  • Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.

  • Drive new process integration (NPI) and process transfer to high-volume manufacturing.

  • Perform root cause analysis and implement robust corrective/preventive actions.

  • Define process control plans, SPC strategies, and OCAP execution.

  • Collaborate cross-functionally with equipment, integration, quality, and R&D teams.

  • Mentor junior engineers and technicians.

  • Interface with suppliers on process and material improvements.

Qualifications

  • Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).

  • At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation).

  • Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.

  • Demonstrated leadership in cross-functional technical projects.

  • Strong analytical, problem-solving, and communication skills

Preferred

  • PhD in Engineering (Electrical, Chemical, Materials, or related).

  • Six Sigma certification (Green/Black Belt).

  • Experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

En bref

Publiée le 22 juillet 2026 · vue pour la première fois le 6 septembre 2026

Offres similaires